Nihon Superior was founded in 1966when it began marketing unique flux products imported from the US.The company made its mark on society by gathering the most advancedsoldering and brazing technologies and products from around theworld, and supplying them to companies in the metal-joiningindustry. A turning point for the company came when it starteddeveloping its own soldering materials and with the success of itsunique SN100C lead-free solder alloy Nihon Superior has become amajor player in the global market. To support the growing demandfor its products Nihon Superior has established manufacturing andsales centers in Japan, China and other Asian countries and formedbusiness partnerships with companies in othermarkets.Nihon Superior(Singapore) Pte. Ltd., subsidiary of Nihon Superior Co. Ltd.(Osaka, Japan), a supplier of advanced soldering and brazingmaterials to the global market.Most of these products are based onthe companys well known silver-free and lead-free solderSN100C® which now has a track record of more than13 years successful delivery of high productivity and highreliability. However there are also some products that have emergedfrom Nihon Superiors exploration of new alloys and newtechnologies. Although at 227°C the melting point of SN100C ishigher than that of high-silver lead-free solders SN100C solderpastes can usually be reflowed with a profile similar to thatcommonly used with SAC305 and SAC405 with a 240°Cpeak. SN100C Bar andSolid Wire for Wave and SelectiveSolderingSN100C revolutionizedlead-free wave soldering by making it possible to get solderingperformance and joint appearance similar to that of tin-lead solderwithout the expensive addition of silver. This was achieved withthe addition of nickel which also provided the benefit of lowcopper dissolution and a stable slow-growing intermetallic. SN100Cis already being used in more than 4000 wave and selectivesoldering machines around the world with more machines beingcommissioned every month. SN100C Bar forHot Air Solder Leveling (HASL)HASL was the mostwidely used PCB finish in the era of tin-lead soldering becausenothing solders like solder and with SN100C it is possible tocontinue using that finish in the lead-free era. The high fluidityand surface tension of SN100C imparted by the nickel addition meansthat the HASL coating is more uniform than tin-lead HASL so thatcoplanarity problems are minimized. The finish is smooth and brightand has the great advantage over other lead-free PCB finishes suchas immersion silver and OSP that it does not require specialpackaging and storage conditions.Solder Pastefor High Density AssemblySN100CP520is a high-reliability halogen-activated no-cleanlead-free solder paste optimized todeliver good reflowwith chip components down to 01005 (0402 metric). SN100C P520improves the joint quality of densely populated boards with filletless, small solder volume chip components and fine-pitch mountingin which a reduction in joint strength is a concern duetothe very small jointsize.GeneralPurpose Flux-Cored Solder WireSN100C(030)is a high-reliability halogen-activated no-cleanflux-cored lead-free solder wire.2ndGeneration Completely-Halogen-FreeSoldering MaterialsNihon Superior iscommitted to supporting the electronics industrys drive toeliminate environmentally-damaging halogens and these new productsdeliver an even higher level of performance in terms of wetting andfillet formation. These halogen-free materials contain no additionsof F, Cl, Br or I but still have excellent soldering performance.For Reflow SolderingSN100C P602D4printing grade solderpasteSN100C P603D4and SN100C P605 D6dispensinggrade pastes for chip components down to 0402 metric.These solderpastes have high activity for good wetting of terminations andreduced mid-chip balling resulting in excellent solderability whiledelivering the high reliability of SN100C.Wave SolderingFluxNS-F900is a robust halogen-free wave soldering flux thatwets even oxidized copper delivering excellent barrel fill andminimizes bridging by facilitating drainage as the joints exit thewave. SN100CAdvantage SeriesThis new series ofalloys builds on the advantages of the tin-copper-nickel system tocreate new alloys that provide performance advantages in particularapplications.SN99CN,the first alloy in this series, has a controlledaddition of silver to deliver improved impact strength on bothcopper and nickel substrates. The alloy still enjoys the benefit ofthe nickel stabilization so the intermetallic that forms on coppersubstrates grows only slowly in elevated temperature service andremains smooth. SN99CN is available as spheres and SN99CNP502 D4solder paste. HighTemperature SolderSN100C7Ais a high temperature solder forthe assembly of power modules that operate at elevatedtemperatures. The fine grain size of the intermetallic ensures goodmechanical properties. ReplacingCopper with AluminumWith appropriateadjustment of dimensions aluminum can provide the same electricaland thermal conductivity as copper at a significantly lowermaterial cost. As such it is a candidate for replacing copper inapplications such as heating, ventilation and air conditioningsystems (HVAC), heat sinks, heat pipes and motor windings. NihonSuperior is now offering solutions to the poor solderability ofaluminum alloys that has limited their used in such applicationsSolder-Coated Aluminum Ribbon for Solar CellTabbingApplying a coating ofSN100C to the aluminum ribbon means that it can be soldered to thesilver metallization of solar cells in the same way as thetin-coated copper ribbon currently used in thatapplicationFlux forSoldering AluminumAluminum solderingflux 1261 makes it possible to achieve a strong reliable joint tocommonly used aluminum alloys. Tin-ZincSolderLF-Z3 PF-14D3halogen-free solder paste is based on thetin-zinc eutectic suitable for soldering silver substrates such asfired silver pads on glass substrates. The peak reflow temperaturesof approximately 225°C is 15°C lower than that of SAC305 and thealloy has much less tendency to erode the silver . PF-14 fluxmedium is especially formulated to avoid degradation of the pasteso that a stable viscosity can be maintained duringstorage.For anyfurther product details or query pleaseContact:NIHON SUPERIOR(SINGAPORE) PTE. LTD.12 LITTLE ROAD, #01-01LIAN CHEONG INDUSTRIAL BUILDING, SINGAPORE536986Tel: +65 67414633Fax: +65 67416636E-mail:[email protected]/[email protected] site:www.nihonsuperior.co.jp/english
