Company Details
Business Type : Manufacturer
Location : Seoul
Year Established : 1996
Number Of Employees : 1 - 5
Export Percentage :
Production Lines :
R&D Staff :
Total Annual Revenue :
Main Products : IC Packaging,IC Assembly, Dummy Components, Chip Packages, BGA, Electronic Packaging
Country/Region : Korea
Links : Korea Agriculture, Korea Agriculture Products Processing,
Company Introduction
We are a " IC Packaging Service" provider for IC design and fabless companies. We use good sub- contractors in Korea and other Asia area for IC assembly. Packages: BGA,QFP,SO,TSOP,QFN,PLCC,PDIP....etc Please contact us if anybody needs our services.
Company Information
Contact Person : S.K.Kang
Job Title : Business Manager
Telephone : 
Fax Number : 
Address : #701, 24, Songpa-daero 28-gil, Songpa-Gu, Seoul
Fax : 82 - 2 - 4041513
Website : Visit website
Company Product
- Dummy QFN Lead Frame Strip with Mold Encapsulation
- IC Assembly Services for Fabless Companies
- IC Packaging(IC Assembly,Dummy Components Build)
- LQFP; Low Profile Quad Flat Package
- PDIP, SPDIP. Dual-In-Line Packages
- PLCC. Plastic Leaded Chip Carrier
- QFN Lead Frame Strips with Mold Cap
- Semiconductor Assembly & Packaging Services
- TSOP(I). Thin Small Outline
