1.Surface Treatment -Electrolyseslead ,Immersion Gold/Nickle,OSP 2. Number of Layer:-- Single Sided , Two-sided and multilayer ,Special layer 3. Max. PCB Size---580mm*460mm 4. PCB Thickness---0.5-0.3mm 5. Copper Foil Thickness---H 1 2 3 4 5 6 10(oz) 6. Insulating Layer Thickness---50 75 100 125 150um 7. Metal Base Type-AL(1100,5052,6061)Cu, Fe, Stainless Steel etc. 8 Metal Substrate---0.5 0.8 1.0 1.2 1.5 2.0 3.0 3.2mm 9. Shaping ---Die PunchingStampingRouteV-Cut10 The Minimum Letter Height---0.8mm 11The Minimum Letter Line Width --- 0.15mm 12.The Minimum Line Width ---0.15mm 13The Minimum Line Spacing---0.15mm 14 The Minimum Hole Diameter---0.5mm 15Special Hole---Spot facing, cup hole