Product Type: 2~24 Layers Board Thickness : 0.3mm~3.2mm Min. Line Width/Spacing: 0.1mm (4mil) Min. Hole Size : 0.20mm (8mil) Aspect Ratio: 6/1 Impedance Control: ± 10% Blind/Buried via hole: Sequential lamination, Laser Drill Surface Finish: HASL, Immersion Gold,Entek(OSP) ,Immersion Tin