We are able to meet different requirements of techniques and customers??needs. Single side(d) Double sides Multi-layer boards(4-24layers) Bury and blind via holes Back board and chip on board for wire bonding Plugged via with resin Heavy copper up to 8OZ Impedance control(min 30ohm +/-10%) Rohs compliance Our quality assurance: ISO9001 / ISO14001 / TS16949 / UL / Rohs We can provide high quality through them: CEM-3/FR4:HTg,low DK,halidfree,high frequency/Teflon/Aluminium substrate,metals base/Rogers/Arlon/Isola/TaconicType of surface finish: Leadfree HAL, Immersion Gold/Tin/Silver, Peelable Mask, Cabon ink. Flash Gold, Golden finger, Select platting up to 3?m(120u??Speciality board: Blind & bury via holes,HDI,Impedance control,Resin tape through via holes,Line width min and line spac min 4 mil,chip on board for wire bonding. As mentioned above,Thanks for your attention, and looking forward to hearing your valuable comments shortly. If you have any question, please do not hesitate to contact me by email. Pls be assured,we will not send you junk mail or pass your details to third parties.
