Data Inputs - Protel, DXP, Gerber, DXF, DWG, CAMMajor Laminate - Kingboard, ShengYi and others produce by customerspecial requestBase Materials – FR4, other materials including High Tg, High CTI,Halogen Free by special requestedPCB Maximum board sizeHASL: 546mm x 320mm, OSP: 630mm x 470mm, Ni/Au: 570mm x 470mmRigid PCB thicknessSingle side to Double side from 0.2mm - 3.0mm4 layers - 0.4mm - 3.0mm / 6 layers - 0.6mm - 3 .0mm / 8 layers -1.0mm - 3.0mm10 layers - 1.20mm - 3.0mm /12 layers - 1.40mm - 3.0mm (Small runand Prototype only)Surface Finishing - HAL / HASL, OSP, Immersion Gold, ImmersionTin Copper Foil - from 0.5oz to 6oz, inner layer up to 3oz Min. Hole size - 0.20mm, Aspect ratio = 8Via holes – Copper PTH, BLIND ViaHDI – Class 1 for single Blind viaImpedance control tolerance - +/-10％ Min. Line Width and Spacing - Max. 0.10mm / 0.10mm (4mil /4mil) Solder resist mask - Liquid Photo-Image (LPI) Silkscreen INK - Thermal Profiling - Routing, V-cut, Punching, CNC V-cut, Push back
