We are an IC packaging house especially in BGA, LGA, QFN, CSP, MCM, stacked dies, and other packaging with lead frames. We have a full range of facilities in our company and be able to do flip chip, COF and others. Fast delivery.We can give you a proposal for how to pack an IC. We can make samples for you for evaluation. We provide one-stop service for your requirement. Please contact us when you have a project on hand. Project preview is free of charge.
