Ntrium Inc.

Company Details

  • Business Type : Manufacturer
  • Location : Gyeonggi-do
  • Year Established : 2013
  • Number Of Employees : 6 - 10
  • Export Percentage :
  • Production Lines :
  • R&D Staff :
  • Total Annual Revenue :
  • Main Products : Nano Convergence Conductive Thermal,
  • Country/Region : Korea
  • Links : Korea Chemicals, Korea Other Inorganic Chemicals,
  • Company Introduction

    Ntrium is the 1st company founded by AICT(Advanced Institutes of Convergence Technology, http://aict.snu.ac.kr/eng/) which is operated by Seoul National University. Ntrium is presented with the opportunity to converge Nano-material technology and the Microelectronics packaging technology of Display / Semiconductor / Mobile / IT products, to solve technical problems customers face, to provide colloaborate and innovative solutions.2012. 08. Graduated with top honors from Young Entrepreneur Academy ? SBC(www.sbc.or.kr)2013. 01. Entered to Institutes of Global Management - IGM (www.igm.or.kr)2013. 02. Ntrium Foundation - The 1st company founded and invested by AICT2013. 08. Top beneficiary of Global R&D Program operated by SMBA (Small and Medium Business Administration)2013. 11. Winner of Startup & Growth Program operated by SMBA2013. 11. Top winner of T2B Program (Material Field) operated by Nano-Technology Research Association(www.nanokorea.net)2013. 11. Conductive Bead Sample for Customer Qualification2014. 01. Winner of Global Start-up Contest by Kotra(www.kotra.or.kr)

    Company Information

  • Contact Person : Andy Kim
  • Job Title : Director
  • Telephone :
  • Fax Number :
  • Address : 9th Floor, AICT C Building, 314 Iui-dong, Yeongtong-gu Suwon-si, Gyeonggi-do
  • Fax : +82 - 31 - 8889555
  • Website : Visit website
  • Company Product

    • Conductive Beads for ACF (Anisotropic Conductive Film)
    • Core Technology
    • MSN (Mesoporous Silica Nano-particle) for DDS (Drug Delivery System)
    • Silver Powder Alternative (Core-Shell) for Printed Electronics
    • TIM (Thermal Interface Material) for Mobile AP Chipset
    • Thermally Enhanced Underfill Filler